RFID tag for an object having metallic portions, tag coupler and method thereof

ABSTRACT

An RFID tag ( 20 ) has an electrically non-conductive substrate ( 22 ) with a mounting surface ( 24 ), an electrically conductive member ( 26 ), a conductive bridge ( 28 ), a dielectric strip ( 30 ), and a semiconductor device ( 32 ). The member ( 26 ) is mounted to the surface ( 24 ) and has an inner section ( 38 ), an outer section ( 40 ) and a connecting section ( 42 ). The section ( 38 ) has windings ( 44 ) and a free end ( 46 ) extending from one of the windings. The section ( 40 ) substantially surrounds the section ( 38 ) and has a winding ( 50 ) and a free end ( 52 ) that extends from a portion ( 54 ) of the winding ( 50 ) towards the section ( 38 ). A segment ( 56 ) of the section ( 42 ) is disposed between the ends ( 46, 52 ). The bridge ( 28 ) spans from the end ( 46 ) to the end ( 52 ). With the strip ( 30 ) disposed between the bridge ( 28 ) and the member ( 26 ), capacitive sections are thereby formed along the strip ( 30 ).

FIELD OF THE INVENTION

The present invention relates to RFID tags that are mounted ontoobjects. In particular, this invention relates to an RFID tag for anobject having metallic portions, a tag coupler and method of forming theRFID tag or the tag coupler.

BACKGROUND OF THE INVENTION

In a radio frequency identification (RFID) system, RFID transponders ortags are usually mounted onto objects to provide information uponreceiving interrogating signals transmitted by a transceiver. In theart, such a transceiver is referred to as a reader. Information providedby an RFID tag upon activation by an interrogating signal can includestatus, location, or presence of an object to which the RFID tag ismounted. Typically, such information is provided either with dataextracted from a semiconductor device of the RFID tag or when the RFIDtag interacts with an RF signal to generate a response signal back tothe reader.

An RFID system has many different applications. For example, one commonapplication of an RFID system is in electronic article surveillance(EAS) to detect movement of items within surveilled area. Typically, insuch an RFID system, an active RFID tag attached to an item isdeactivated when movement is authorized. Otherwise, if the active RFIDtag is not deactivated, then an alert signal is generated by the RFIDsystem when the item with an active RF tag is conveyed into an areawhere interrogating signals are present.

Interrogating signals transmitted to an RFID tag are received via anantenna. Such an antenna typically forms part of a resonant circuit ofthe RFID tag. Generally, the resonant circuit is tuned to a resonantfrequency corresponding to the frequency of the interrogating signals.FIG. 1 illustrates a prior art RFID tag 10 having a substrate 12 with asemiconductor device 14 that is coupled to coil windings 16.

A problem with existing RFID tags is that objects with electromagneticproperties adversely affect resonant frequencies of these existing RFIDtags. One technique of overcoming this problem is described in U.S. Pat.No. 5,276,431 Piccoli et al. in which a security tag has a resonantcircuit that compensates for inherent capacitance of an article tothereby shift a resonant frequency of the resonant circuit closer to thecenter frequency of a detection frequency range. However, the resonantcircuit described in U.S. Pat. No. 5,276,431 Piccoli et al. provides fora predetermined detection frequency range and, therefore, is notoptimized for accurate detection of a specific detection frequency.

Another prior art RFID tag is described by U.S. Pat. No. 5,541,399 deVail in which an RF transponder is fabricated on a single side of asubstrate and has a lead line that yields capacitances in crossing overwindings of an antenna for the RF transponder. Although this techniquereduces cost of the RFID transponder that is easier to attach to manydifferent types of packages, the total capacitance provided at crossoversites along the lead line is limited because of the width of the antennawindings. Hence, a discrete capacitor may still be needed to increasethe total capacitance to attain a desired antenna resonant frequency.

Although the above existing RFID tags overcome various problems, thereis still a need for a more effective RFID tag that is easier tomanufacture and has a wider capacitive range without having to usediscrete capacitors. Also, metallic portions of some objects or productsare known to interfere RF or electromagnetic fields and this reduceseffective range of RFID tags mounted to such objects. For example,metallic portions in compact discs and the like are known to disrupt RFor electromagnetic fields around RFID tags attached to the compactdiscs.

Furthermore, RF or electromagnetic fields of an RFID tag are typicallyweakened when the RFID tag is mounted to a metallic product such acompact discs and the like and housed within a carrier. In thissituation, the RFID tag is less effective and this adversely affectssensing range of a reader that interrogates the RFID tag.

Therefore, what is needed is RFID tag that overcomes poor RF orelectromagnetic fields when mounted to an object having metallicportions. What is also needed is a tag coupler for an RFID tag mountedto a metallic product to thereby improve detecting range of a readerthat interrogates the RFID tag when the product is housed within aproduct carrier.

SUMMARY OF THE INVENTION

The present invention seeks to provide a radio frequency identification(RFID) tag, a tag coupler for the RFID tag and a method of forming theRFID tag or tag coupler.

Accordingly, in one aspect, the present invention provides a radiofrequency identification (RFID) tag comprising:

-   a substantially planar and electrically non-conductive substrate    having a mounting surface;-   a substantially planar and electrically conductive member mounted to    the mounting surface, the conductive member having:    -   an inner section comprising:        -   one or more windings;        -   an inner section free end extending from one of the            windings;    -   an outer section, substantially surrounding the inner section,        the outer section comprising:        -   one or more windings;        -   an outer section free end extending from one of the            windings; and    -   a connecting section connecting the inner section to the outer        section;-   a conductive bridge spanning from the inner section free end to the    outer section free end; and-   at least one dielectric strip disposed between the conductive bridge    and the conductive member to thereby form one or more capacitive    sections along the at least one dielectric strip.

In another aspect, the present invention provides a tag coupler for aradio frequency identification (RFID) tag housed within a productcarrier, the tag coupler comprising:

-   an electrically conductive member having:    -   an inner section comprising:        -   one or more windings;        -   an inner section free end extending from one of the            windings;    -   an outer section, substantially surrounding the inner section,        the outer section comprising:        -   one or more windings;        -   an outer section free end extending from one of the            windings; and    -   a connecting section connecting the inner section to the outer        section;-   a conductive bridge spanning from the inner section free end to the    outer section free end; and-   at least one dielectric strip disposed between the conductive bridge    and the conductive member to thereby form one or more capacitive    sections along the at least one dielectric strip.

In yet another aspect, the present invention provides a method offorming a radio frequency identification (RFID) tag, the methodcomprising:

-   providing a substantially planar and electrically non-conductive    substrate having a mounting surface;-   forming a substantially planar and electrically conductive member on    the mounting surface, the conductive member having an inner section    free end extending from an inner section and an outer section free    end extending from an outer section, the inner section being    connected via a connecting section to the outer section, the    connecting section being disposed between the inner section free end    and the outer section free end;-   attaching at least one dielectric strip onto one or more portions of    the conductive member; and-   printing a conductive bridge onto the at least one dielectric strip    to thereby form one or more capacitive sections along the at least    one dielectric strip.

BRIEF DESCRIPTION OF THE DRAWINGS

A preferred embodiment and alternate embodiments of the presentinvention is more fully described, by way of example, with reference tothe drawings of which:

FIG. 1 illustrates a prior art RFID tag;

FIG. 2 illustrates an RFID tag in accordance with the preferredembodiment of the present invention;

FIG. 3 illustrates a tag coupler for the RFID tag in accordance with analternate embodiment of the present invention;

FIG. 4 illustrates an RFID tag in accordance with yet another alternateembodiment of the present invention; and

FIG. 5 is a flowchart of a method of forming the RFID tag of FIG. 2 orFIG. 4 and the tag coupler of FIG. 3.

DETAILED DESCRIPTION OF THE DRAWINGS

A radio frequency identification (RFID) tag, a tag coupler for the RFIDtag and a method of forming the RFID tag or the tag coupler inaccordance with a preferred embodiment and alternate embodiments of theinvention are described. In the following description, details areprovided to describe these embodiments. It shall be apparent to oneskilled in the art, however, that the invention may be practiced withoutsuch details. Some of these details may not be described at length so asnot to obscure the invention.

There are many advantages of the invention. One advantage of theinvention is that the RFID tag is more effective than existing RFID tagswhen mounted to objects with metallic portions. Consequently, undesiredinterference or disruption of radio frequency (RF) or electromagneticfield around the RFID tag by the metallic portions is alleviated.

Another advantage of the invention is that the tag coupler improves RFor electromagnetic coupling between a reader and an existing RFID tagmounted to a product carried within a product carrier. This thereforeimproves detecting range of the product without having to change theexisting RFID tag already mounted to the product.

Yet another advantage of the invention is that the RFID tag supports awider possible range of capacitances without needing discrete capacitorsto increase total capacitance as required by existing RFID tags. Hence,the invention enables the RFID tag or the tag coupler to be more easilytuned to desired resonant frequencies than existing RFID tags.

In describing the embodiments of the invention, similar elements sharethe same references. To simplify the drawings, an element may not benumbered in a later drawing if the element has been indicated in anearlier drawing.

Referring now to FIG. 2, an RFID tag 20 in accordance with the preferredembodiment of the present invention is illustrated. The RFID tag 20comprises a substantially planar and electrically non-conductivesubstrate 22 having a mounting surface 24, a substantially planar andelectrically conductive member 26, a conductive bridge 28, a dielectricstrip 30, and a semiconductor device 32. The substrate 22 has a spindleaperture 34 formed at a center portion 36. When mounted in alignmentwith the product such as, for example, a compact disc or the like, thespindle aperture 34 enables the compact disc to couple to a spindle in adisc drive or to internal engagement members of a disc product carrier.

The conductive member 26 is mounted to the mounting surface 24 andcomprises an inner section 38, an outer section 40 and a connectingsection 42 that connects the inner section 38 to the outer section 40.These sections 38,40,42 are formed with an electrically conductivematerial such as, for example, copper, silver, or gold.

The inner section 38 has windings 44 and an inner section free end 46extending from one of the windings. In the preferred embodiment, theinner section free end 46 extends from an outermost winding 48 towardsthe outer section 40.

The outer section 40 substantially surrounds the inner section 38. Inthe preferred embodiment, the outer section 40 has a winding 50 and anouter section free end 52. This winding 50 of the outer section 40 iswider than each of the windings 44 of the inner section 38. The outersection free end 52 extends from a portion 54 of the winding 50 towardsthe inner section 38. It is to be noted that if the outer section 40 hasmore than one winding, then the outer section free end 52 extends froman innermost winding of the outer section 40 towards the inner section38.

In connecting the inner section 38 to the outer section 40, a segment 56of the connecting section 42 is disposed between the inner section freeend 46 and the outer section free end 52. This segment 56 is smaller inwidth than other segments 58,60 of the connecting section 46 thatrespectively adjoin the inner section 38 and the outer section 40.

The conductive bridge 28 spans from the inner section free end 46 to theouter section free end 52. With the dielectric strip 30 disposed betweenthe conductive bridge 28 and the conductive member 26, three capacitivesections are thereby formed along the dielectric strip 30. Specifically,a capacitive section 62 is formed at the portion 46 a of the innersection free end 46, another capacitive section 64 is formed at thesegment 56, and yet another capacitive section 66 is formed at theportion 52 a of the outer section free end 52.

The semiconductor device 32 has two terminals (not shown) that areelectrically connected to two conductive pads 68,70. These twoconductive pads 68,70 are disposed in association with the windings 44of the inner section 38 such that the windings 44 are electricallycoupled to the two terminals of the semiconductor device 32. Thesemiconductor device 32 stores information on the product such that uponreceiving interrogation signals from a reader, the information isprovided or retrieved from the semiconductor device 32.

Dimensions of the RFID tag 20 depends on desired resonant frequency or adesired detection frequency range. For example, to receive interrogatingsignals at a desired resonant frequency of 13.56 Megahertz (MHz) withina 5% tolerance range, the winding 50 has a width of 3.1 millimeters(mm), the inner section 38 has seven windings 44 each having a 0.15 mmwidth, the capacitive sections 62,66 are each 3 mm by 1 mm, theconductive bridge 28 has a 3 mm width, and the dielectric strip 30 is4.5 nm by 5 mm. The outer section 40 has an outer diameter of 110 mm andthe inner section 38 has an outer diameter of 40 mm. The dielectricstrip 39 for this example has a dielectric constant of 4.5. Typicalcapacitances at each of the three capacitive sections 62,64,66 are 6picofarads (pF) each. It is to be noted that each of these dimensionsvaries in tolerance to provide the desired resonant frequency of 13.56Megahertz (MHz) within the 5% tolerance range.

FIG. 3 illustrates a tag coupler 100 in accordance with an alternateembodiment of the present invention. The tag coupler 100 couples to theRF or electromagnetic field of an RFID tag mounted to a compact disc(CD) that is housed within a product carrier (not shown in FIG. 3). Sucha product carrier can be, for example, a compact disc (CD) casing or aCD storage box.

The tag coupler 100 comprises an electrically conductive member 102, aconductive bridge 104, and a dielectric strip 106. The conductive member102 comprises an inner section 108, an outer section 110 and aconnecting section 112 that connects the inner section 108 to the outersection 110. These sections 108,110,112 are formed with an electricallyconductive material such as, for example, copper, silver, or gold.

The inner section 108 has a winding 114 and an inner section free end116 extending from the winding 114. In this alternate embodiment, theinner section 108 is substantially circular and the inner section freeend 116 extends from the winding 114 towards the outer section 110. Theinner section free end 116 is wider than the winding 114 of the innersection 108.

The outer section 110 substantially surrounds the inner section 108. Inthis alternate embodiment, the outer section 110 is non-circular toalign with typical shapes of existing product carriers and has a winding120 and an outer section free end 122. Width of the winding 120 of theouter section 110 is about the same as width of the winding 114 of theinner section 108. The outer section free end 122 extends from a portion124 of the winding 120 towards the inner section 108. The outer sectionfree end 122 is wider than the winding 120 of the outer section 110.

It is to be noted that if the inner section 108 has more than onewinding, then the inner section free end 116 extends from an outermostwinding towards the outer section 110. Similarly, if the outer section110 has more than one winding, then the outer section free end 122extends from an innermost winding towards the inner section 108.

In connecting the inner section 108 to the outer section 110, a segment112 a of the connecting section 112 is disposed between the free ends116,122. Width of the segment 112 a is about the same as width of othersegments 112 b,112 c of the connecting section 112 that adjoin,respectively, the outer section 110 (at the portion 124) and the innersection 108.

The conductive bridge 104 spans from the inner section free end 116 tothe outer section free end 122. With the dielectric strip 106 disposedbetween the conductive bridge 104 and the conductive member 102,capacitive sections are thereby formed along the dielectric strip 106 atthe segment 112 a of the connecting section 112, the inner section freeend 116, and the outer section free end 122.

For the tag coupler 100, three capacitive sections are formed along thedielectric strip 106. Specifically, a capacitive section 130 is formedat the segment 112 a of the connecting section 112, another capacitivesection 132 is formed at the inner section free end 116, and yet anothercapacitive section 134 is formed at the outer section free end 122.

The tag coupler 100 is mountable to a substantially planar andelectrically non-conductive substrate 136 having a mounting surface 138.The non-conductive substrate 136 may be a discrete element, or providedby a part of the product or the product carrier. For example, theconductive member 102 may be mounted directly onto a CD casing with asurface that serves as the mounting surface 138.

Dimensions of the tag coupler 100 also depend on desired resonantfrequency or a desired detection frequency range. For interrogatingsignals at the desired resonant frequency of 13.56 Megahertz (MHz)within a 5% tolerance range, the windings 120 each has a width of 1millimeter (mm), the capacitive section 130 is 1 mm by 16 mm, thecapacitive section 132 is 5 mm by 16 mm, the capacitive section 134 is10 mm by 13 mm, the conductive bridge 104 is 25 mm by 16 mm, and thedielectric strip 106 is 24 mm by 18 mm. The outer section 110 forms aninner area of 120 mm by 110 mm and the inner section 108 has an innerdiameter of 32 mm. The dielectric strip 106 for this example also has adielectric constant of 4.5. Typical capacitances at each of the threecapacitive sections 130,132,134 are 32 pF, 159 pF and 259 pF,respectively. It is to be noted that each of these dimensions varies intolerance to provide the desired resonant frequency of 13.56 Megahertz(MHz) within the 5% tolerance range.

FIG. 4 illustrates an RFID tag 200 in accordance with yet anotheralternate embodiment of the present invention. It is to be noted thatthe RFID tag 200 has certain features that are similar to the RFID tag20. The RFID tag 200 is mountable to either a metallic product or aproduct carrier for the metallic product.

The RFID tag 200 comprises an electrically conductive member 202, aconductive bridge 204, a dielectric strip 206, and a semiconductordevice 208. Specific details of the conductive member 202, theconductive bridge 204, the dielectric strip 206, and the semiconductordevice 208 are not indicated or described here as these details aresimilar to the RFID tag 20 described earlier in the above.

The RFID tag 200 is mountable to a substantially planar and electricallynon-conductive substrate 210 having a mounting surface 212. Thenon-conductive substrate 210 may be a discrete element, or provided by apart of the product or the product carrier. For example, the conductivemember 202 may be mounted directly onto a surface of a CD or CD casingwith that surface serving as the mounting surface 212.

The RFID tag 200 has inner section 214 that comprises an indentedsection 216. The indented section 216 has two free ends 218,220. Each ofthe two free ends 218,220 extends, respectively, from a winding 222,224of the inner section 214. The indented section 216 comprises aconductive bridge 226 connecting the two free ends 218,220.

A dielectric strip 228 is disposed between the conductive bridge 226 andthe two free ends 218,220 to thereby form five capacitive sections 230a,230 b,230 c,230 d,230 e along the dielectric strip 228. Thesecapacitive sections 230 correspond to portions of the indented section216 at which the dielectric strip 228 is disposed between the windingsof the inner section 214 and the conductive bridge 226. The winding222,224 of each of the two free ends 218,220 are separated by otherwindings 232 a,232 b,232 c of the inner section 214 at the indentedsection 216.

It is to be noted that the RFID tag 200 has an outer section 234 and aconnecting section 236 much like the RFID tag 20. At the connectingsection 236, the conductive bridge 204 and the dielectric strip 206 alsoform one or more capacitive sections.

Referring now to FIG. 5, a flowchart of a method 300 of forming the RFIDtag 20, the tag coupler 100, or the RFID tag 200 is shown in accordancewith yet another alternate embodiment of the invention. It is to benoted that some elements in the following description of the method 300are not referenced as such elements refer generally to elementsdescribed earlier and that are related to the RFID tag 20, the tagcoupler 100, or the RFID tag 200.

The method 300 starts by providing 302 a substantially planar andelectrically non-conductive substrate having a mounting surface. Thenon-conductive substrate can be, for example, a polyester sheet.

The method 300 continues with forming 304 a substantially planar andelectrically conductive member on the mounting surface. The conductivemember has an inner section free end extending from au inner section andan outer section free end extending from an outer section. The innersection is connected via a connecting section to the outer section asdescribed earlier for the RFID tag 20, the tag coupler 100 and the RFIDtag 200. The connecting section is disposed between the inner sectionfree end and the outer section free end.

For the RFID tag 200, the forming 304 comprises forming the indentedsection 216 having the two free ends 218,220 at the inner section 214.Each of the two free ends 218,220 extends from the winding 222,224,respectively, of the inner section 214.

One technique of forming 304 the conductive member is by laminating aconductive material onto the mounting surface and then etching theconductive material to thereby form the conductive member. Copper is oneconductive material that can be used for this forming 304.

The method 300 continues with attaching 306 a dielectric strip onto oneor more portions of the conductive member. Size and number of theseportions are variable to obtain various resonant frequencies dependingon design requirements of the RFID tag 20, the tag coupler 100, or theRFID tag 200 in terms of resonant frequency. This attaching 306 can beby printing the dielectric strip onto the one or more portions. In thepreferred embodiment, the printing is onto a portion each of theconnecting section, the inner section free end and the outer sectionfree end. For the connecting section, the dielectric strip is necessaryto insulate the conductive bridge from the segment between the innersection free end and the outer section free end. The attaching 306 alsocomprise curing the dielectric strip when necessary, depending onmaterial used for the dielectric strip.

For the RFID tag 200, the attaching 306 comprise printing the dielectricstrip 228 onto one or more portions of the indented section 216.Accordingly, the RFID tag 200 now has the two dielectric strips 206,228that need curing.

After attaching the dielectric strip, the method 300 proceeds toprinting 308 a conductive bridge onto the dielectric strip to therebyform capacitive sections along the dielectric strip as required by thedesign requirements of the RFID tag 20, the tag coupler 100, or the RFIDtag 200. For the RFID tag 200, the conductive bridge is also printedonto at least one portion of the dielectric strip 228 to thereby formone or more capacitive sections along the dielectric strip 228 at theindented section 216.

Thereafter, mounting 310 of a semiconductor device to at least twoconductive pads of the conductive member takes place. The method 300then proceeds to applying 312 an adhesive onto an attachment surface ofthe non-conductive substrate. The attachment surface is opposite to themounting surface.

After applying 312 the adhesive, the method 300 provides for shaping 314the non-conductive substrate for attachment to a component Such acomponent may be, for example, a CD or a carrier for the CD. For a CD,the shaping 314 includes punching a spindle aperture at a center portionof the non-conductive substrate.

It is to be noted that the flowchart of FIG. 5 refer specifically to themethod 300 of forming the RFID tag 20 and the RFID tag 200. However, forthe tag coupler 100, the step of mounting 310 is not required.Therefore, the flowchart is also applicable to form the tag coupler 100,as it is easily understood by persons skilled in the art that themounting 310 of a semiconductor device is not needed for the tag coupler100.

The present invention therefore provides the RFID tag 20, the tagcoupler 100, the RFID tag 200 and the method 300 to overcome, or atleast alleviate, the problems of the prior art.

It shall be appreciated that although one preferred embodiment has beendescribed in detail, various modifications and improvements can be madeby persons skilled in the art without departing from the scope of thepresent invention.

1. A radio frequency identification (RFID) tag comprising: asubstantially planar and electrically non-conductive substrate having amounting surface; a substantially planar and electrically conductivemember mounted to said mounting surface, said conductive member having:an inner section comprising: one or more windings; a broken sectionbetween a first and a second open positions in one of said windings; andan inner section free end extending from said first open position; anouter section, being disposed near the edge of said mounting surface andsubstantially surrounding said inner section, said outer sectioncomprising: one or more windings with the innermost winding beingsignificantly separated from the outermost winding of said inner sectionwith respect to the average pitch value of said inner section windings;the width of said outer section windings may be different from the widthof said inner section windings; and an outer section free end extendingfrom the outermost winding of said outer section; a connecting sectionconnecting said second open position of said inner section to theinnermost winding of said outer section; a conductive bridge crossingover a connecting segment within said connecting section and spanningfrom said inner section free end to said outer section free end; and atleast one dielectric strip disposed between said conductive bridge andsaid conductive member to thereby form one or more capacitive sectionsalong said at least one dielectric strip.
 2. The RFID tag of claim 1,wherein said connecting segment is disposed between said inner sectionfree end and said outer section free end.
 3. The RFID tag of claim 2,wherein said capacitive sections comprise a capacitive section at aportion of said connecting segment.
 4. The RFID tag of claim 3, whereinsaid capacitive sections further comprise another capacitive section ata portion of said inner section free end.
 5. The RFID tag of claim 3,wherein said capacitive sections further comprise another capacitivesection at a portion of said outer section free end.
 6. The RFID tag ofclaim 1, and further comprising a semiconductor device having at leasttwo terminals electrically and respectively connected to at least twoconductive pads of said conductive member.
 7. The RFID tag of claim 6,wherein said at least two conductive pads are disposed in associationwith said windings of said inner section.
 8. The RFID tag of claim 1,wherein said inner section free end extends towards said outer section.9. The RFID tag of claim 1, wherein said outer section free end extendstowards said inner section.
 10. The RFID tag of claim 1, wherein saidconnecting section extends from the outermost winding of said innersection to the innermost winding of said outer section.
 11. The RFID tagof claim 1, wherein said non-conductive substrate has a spindle apertureformed at a center portion thereof.
 12. The RFID tag of claim 1, whereinsaid inner section comprises an indented section, said indented sectionhaving two free ends, each of said two free ends extending from awinding of said inner section.
 13. The RFID tag, of claim 12, whereinsaid indented section comprises a conductive bridge connecting said twofree ends.
 14. The RFID tag of claim 13, wherein at least one dielectricstrip is disposed between said conductive bridge and said two free endsto thereby form one or more capacitive sections along said at least onedielectric strip.
 15. The RFID tag of claim 13, wherein said winding ofeach of said two free ends are separated by other windings of said innersection at said indented section.
 16. A tag coupler for a radiofrequency identification (REID) tag housed within a product carrier,said tag coupler comprising: an electrically conductive member having:an inner section comprising: one or more windings; a broken sectionbetween a first and a second open positions in one of said windings; andan inner section free end extending from said first open position; anouter section, being disposed near the edge of said mounting surface andsubstantially surrounding said inner section, said outer sectioncomprising: one or more windings with the innermost winding beingsignificantly separated from the outermost winding of said inner sectionwith respect to the average pitch value of said inner section windings;and an outer section free end extending from the outermost winding ofsaid outer section; a connecting section connecting said second openposition of said inner section to the innermost winding of said outersection; a conductive bridge crossing over a connecting segment withinsaid connecting section and spanning from said inner section free end tosaid outer section free end; and at least one dielectric strip disposedbetween said conductive bridge and said conductive member to therebyform one or more capacitive sections along said at least one dielectricstrip.
 17. The tag coupler of claim 16, wherein said connecting segmentis disposed between said inner section free end and said outer sectionfree end.
 18. The tag coupler of claim 17, wherein said capacitivesections comprise a capacitive section at a portion of said connectingsegment.
 19. The tag coupler of claim 18, wherein said capacitivesections further comprise another capacitive section at a portion ofsaid inner section free end.
 20. The tag coupler of claim 18, whereinsaid capacitive sections further comprise another capacitive section ata portion of said outer section free end.
 21. The tag coupler of claim16, wherein said inner section free end extends towards said outersection.
 22. The tag coupler of claim 16, wherein said outer sectionfree end extends towards said inner section.
 23. The tag coupler ofclaim 16, wherein said connecting section extends from the outermostwinding of said inner section to the innermost winding of said outersection.
 24. The tag coupler of claim 16, and further comprising asubstantially planar substrate having an electrically non-conductivemounting surface, said mounting surface being for mounting saidconductive member.
 25. A method of forming a radio frequencyidentification (RFID) tag, said method comprising: providing asubstantially planar and electrically non-conductive substrate having amounting surface; forming a substantially planar and electricallyconductive member on said mounting surface, said conductive memberhaving: an inner section comprising: one or more windings; a brokensection between a first and a second open positions in one of saidwindings; and an inner section free end extending from said first openposition; an outer section, being disposed near the edge of saidmounting surface and substantially surrounding said inner section, saidouter section comprising: one or more windings with its innermostwinding being significantly separated from the outermost winding of saidinner section with respect to the average pitch value of said innersection windings; the width of said outer section windings may bedifferent from the width of said inner section windings; and an outersection free end extending from the outermost winding of said outersection; said second open position of said inner section and the innermost winding of said outer section being connected via a connectingsection, said connecting section being disposed between said innersection free end and said outer section free end; attaching at least onedielectric strip onto one or more portions of said conducive member; andprinting a conductive bridge which crosses over said connecting segmentand spans from said inner section free end to said outer section freeend onto said at least one dielectric strip; wherein said at least onedielectric strip disposed between said conductive bridge and saidconductive member to thereby form one or more capacitive sections alongsaid at least one dielectric strip.
 26. The method of claim 25, whereinsaid forming comprises: laminating a conductive material onto saidmounting surface; and etching said conductive material to thereby formsaid conductive member.
 27. The method of claim 25, wherein saidattaching comprises printing said at least one dielectric strip onto aportion of said connecting segment.
 28. The method of claim 27, whereinsaid attaching further comprises printing said at least one dielectricstrip onto a portion of said inner section free end.
 29. The method ofclaim 27, wherein said attaching further comprises printing said atleast one dielectric strip onto a portion of said outer section freeend.
 30. The method of claim 27, wherein said attaching furthercomprises curing said at least one dielectric strip.
 31. The method ofclaim 25, and further comprising mounting a semiconductor device to atleast two conductive pads of said conductive member.
 32. The method ofclaim 25, and further comprising applying an adhesive onto an attachmentsurface of said non-conductive substrate, said attachment surface beingopposite to said mounting surface.
 33. The method of claim 25, andfurther comprising shaping said non-conductive substrate for attachmentto a component.
 34. The method of claim 33, wherein said shapingcomprises punching a spindle aperture at a center portion of saidnon-conductive substrate.
 35. The method of claim 25, wherein saidforming comprises forming an indented section at said inner section,said indented section having two free ends, each of said two free endsextending from a winding of said inner section.
 36. The method of claim35, wherein said attaching comprises printing at least one dielectricstrip onto one or more portions of said indented section.
 37. The methodof claim 36, wherein said attaching further comprises curing said atleast one dielectric strip.
 38. The method of claim 36, wherein saidprinting comprises printing a conductive bridge onto at least oneportion of said at least one dielectric strip to thereby form one ormore capacitive sections along said at least one dielectric strip atsaid indented section.